From the Dean's Desk: Bench to Blueprint
Florida is staking its claim in the semiconductor era.
FIU's growing role in this space is supported by our nationally recognized research strength, including a recent Top 40 national ranking among U.S. public institutions in electrical, electronic and communications engineering R&D expenditures (NSF HERD).
In February, President Nuñez reported to the FIU Board of Trustees that FIU has secured $2.1 million in a direct congressional earmark, championed by Congressman Carlos Gimenez, for the Interdisciplinary Engineering and Computing Initiative to Advance Semiconductor Industry and National Security. The funding will strengthen the semiconductor supply chain, support workforce training, and address vulnerabilities in advanced manufacturing.
- Top 40 U.S. Public Universities — Electrical, Electronic & Communications Engineering R&D (NSF HERD)
- $2.1M Federal Funding — Semiconductor Initiative
Our momentum is strong. This month, I want to share three moments from February and early March that demonstrate FIU's growing role in America's semiconductor story.
Co-Chairing the Conversation: Dr. John Volakis at the Florida Semiconductor Summit
In February, Distinguished Professor John Volakis co-chaired the fourth annual Florida Semiconductor Summit in Orlando.
Dr. Volakis is a decorated electromagnetics researcher, the recipient of the 2026 IEEE Electromagnetics Medal, and the holder of the Lucent Technologies CALA Distinguished Professorship. He brings decades of pioneering work in Radio Frequency (RF) and electromagnetics with an unmatched expertise to benefit the U.S. microelectronics manufacturing and RF packaging industry.
Working with Associate Professor Markondeya "Raj" Pulugurtha and Assistant Professor Constantinos Zekios, their NSF-funded research develops AI-driven digital twin models that can monitor and correct manufacturing processes in real time, potentially achieving a 10x speed-up in device diagnosis. Their engagement with the SMART USA Institute, a $285 million federal consortium focused on digital twins for semiconductor manufacturing, positions FIU at the center of the national effort. Approximately 60 students are gaining exposure to these technologies at CEC's RFCOM Lab.
"The same principles that define great antenna and RF design — precision, integration, managing interference across complex systems — are exactly what advanced semiconductor packaging demands. We are applying decades of electromagnetics expertise to help solve one of manufacturing's most urgent challenges and training the next generation of engineers to do the same."
— John Volakis, Professor and Co-Director of RFCOM Laboratory, Electrical & Computer Engineering
Bridging Academia and Industry: The Dean's Panel
On the final day of the Summit, I chaired a panel titled "Converging Paths: Fostering Dialogue Between Academia and Industry," with senior leaders from L3Harris Technologies, Qorvo, NY-CREATES, and Synopsys.
We focused on a central challenge: building the workforce that will staff semiconductor facilities. Panelists were unanimous that industry can no longer take a transactional approach, posting jobs and offering standard internships, and expect to close the talent gap. What emerged instead was a vision for deeper engagement: co-designed research programs that mirror real workforce needs, structured internships that function as genuine identity-forming experiences for students, and expanded access to industry-grade fabrication and design infrastructure that many universities simply cannot afford on their own.
The mutual benefit framing resonated throughout: universities gain research funding and relevance; companies gain early access to talent and a role in shaping the next generation of engineers; and students gain clarity, credentials, and professional networks.
I came away from the panel with a clear takeaway: the appetite among industry leaders to help close talent gaps has never been stronger.
Hosting the Future: DHARMA.AI at FIU
On March 6, our Innovation Complex hosted the second planning meeting for DHARMA.AI, an NSF-sponsored project led by Dr. Arjuna Madanayake and co-PI Dr. Christian Poellabauer that is building AI-ready wireless testbeds for 6G and next-generation networking research. The meeting drew researchers from Northeastern, Princeton, SUNY Poly, NC State, and the University of Miami, alongside Lockheed Martin.
Semiconductor competitiveness depends on building the intelligent systems those chips will power: the AI-driven wireless infrastructure, real-time spectrum sensing and perception, and shared research platforms that will define communications for decades to come. Dr. Madanayake's team is doing that work here at FIU.
"The future of wireless communications will be built on AI-driven infrastructure. Our job is to build AI-driven testbeds, train the talent, and make sure FIU is at the table when that future takes shape."
— Dr. Arjuna Madanayake
Florida is moving quickly to secure its place in the semiconductor era, and FIU is helping lead the way.