Biography
Pulugurtha’s primary research is in the heterogeneous integration and advanced packaging of electronics and bioelectronics. He developed a broad set of technologies for electronic and bioelectronic packaging based on power module integration with advanced passive components, 3D packaging for wireless communication modules, wireless sensor devices with advanced telemetry, advanced packaging substrates, device-to-package and package-to-board interconnection technologies, interconnect materials, embedded-chip packaging, and packaging materials for various functions and reliability. He co-led the development of package-integrated sensor and telemetry modules for multimodal sensing, world’s first 3D glass LTE diversity module and 3D glass antenna-integrated package module for 5G mm wave applications, which are now becoming the mainstream semiconductor hardware platforms for future electronics. Working with several end-users and manufacturers, he developed advanced substrate-integrated power inductors and power capacitors for integrated power modules and voltage regulators. These are published in >400 articles as patents, journal and conference publications in flagship IEEE conferences.
He serves as Associate Editor for IEEE CPMT Transactions, Committee Co-Chair for IEEE Nanopackaging Technical Committee (EPS and NTC), IEEE Miami Chapter and Student Chapters. He advised, co-advised and mentored more than 40 MS and PhD students who are current leaders and technology pioneers in the electronic packaging industry, many of whom work for Apple Inc, Intel, Qualcomm, Texas Instruments, Broadcom and other major electronics manufacturers. He coauthored roadmaps for IEEE Heterogeneous Integration (HIR, Chapter 10 and Chapter 15), Institute of Printed Circuits (IPC) and Power Sources Manufacturers Association. He received ~40 best-paper awards in IEEE packaging and nanotechnology conferences and workshops. He delivered 40 invited lectures (including several keynote and plenary talks, more than 10 of them as IEEE distinguished lecturer and distinguished professor talks at industry technical board meetings) and seminars, and offered several industry short courses, plenary and keynote talks on new technology development in major conferences. His publications and presentations received more than 40 awards.
Awards & Honors
- • IEEE Distinguished Lecturer 2025-2029, Electronic Packaging Society
- • Best Associate Editor Award, IEEE Transactions of Components, Packaging and Manufacturing Technologies, 2025
- • IEEE Distinguished Lecturer 2020-2022, Nanotechnology Council,
- • Best Associate Editor Award, 2021, IEEE Transactions of Components, Packaging and Manufacturing Technologies
- • More than 35 research paper and student presentation awards at several IEEE and other conferences and workshops
Education
- Ph.D., June, 1999 Rutgers University, New Jersey, USA
- M.S., June, 1997 Rutgers University, New Jersey, USA
- M.E., May, 1995, Indian Inst. of Science, Bangalore
- B.Tech., May, 1993 Indian Inst. of Technology, Kanpur, India