It is the beginning of another exciting academic year here at FIU’s College of Engineering and Computing. As we open a new chapter, I would like to share a few things with you that our Engineering and Computing Panthers are exhilarated about.
First, our college is strategically emphasizing several key areas of research to make our mission of addressing real-world challenges even more impactful. We are charting a new course by focusing on some of our society’s greatest challenges with the goals of boosting research capabilities, attracting significant funding and enhancing FIU’s reputation as a leader in innovative research. These categories include resilient infrastructure; neuro and cardiovascular health; artificial intelligence; AI-driven health technologies; cybersecurity; automation & robotics; advanced manufacturing & materials; and next generation electronics.
At FIU, this mission isn’t just talk. We have ‘CHIPS’ on the table.
Two years ago, the CHIPS and Science Act, which provides funding to bolster U.S. leadership in the manufacturing of semiconductor chips, was enacted. This act also provided major support for the advancement of other technologies.
Today, I would like to share with you a little bit about our progress in one of the critical areas prioritized by the CHIPS and Science Act: telecommunications technologies. Our researchers are exploring ways to design radio frequency systems so that they can communicate at frequencies which are rarely in use today. To do this, our faculty members are innovating in electronics by finding new ways to package antenna arrays, radio components, computer chips and wiring all together in one incredibly efficient device.
This research has the potential to give our partners in government, industry and defense a strategic edge in communications. Leading the way are Drs. John Volakis, an expert in radio frequency communications, and Raj Pulugurtha, an expert in semiconductor hardware integration with other system components, also commonly known as packaging of electronics. Their research promises to push boundaries in radio frequency technology, electronics packaging, high density circuits, high efficiency power delivery circuits and sensors with wireless IoT. Simultaneously, our researchers are mentoring approximately 60 students in these cutting-edge technologies at our RF Communications, Millimeter-Waves, and Terahertz Lab.
These days, there are reminders about the incredible opportunities we have at FIU everywhere I turn. Our glimmering, spacious Innovation Engineering Complex at Modesto A. Maidique Campus is nearly complete. Students are back in full, buzzing about their latest classes and pushing themselves to learn and grow. Activity on our campuses will only ramp up from here. In just a few weeks, INIT FIU will host ShellHacks, Florida’s largest hackathon, right here at our university, with top companies in tech and more than one thousand students expected in attendance.
The future is looking bright here for Panther Nation. I look forward to staying connected with you as we embrace what comes next.
Sincerely,
Inés R. Triay
Interim Dean, FIU’s College of Engineering and Computing